Semiconductor Sealing Rings: Ending Japan’s 90% Monopoly

Sealing rings, though small, determine equipment longevity. Japan’s Eagle Industry monopolizes 90% of the high-end market, causing 6-month delivery delays and production risks for Chinese fabs. Technical gaps are stark: domestic rings last only 500 hours (vs. 3,000 hours for imports) with higher contamination rates.

Breakthroughs emerged from material innovation. Jiangsu Funcreate’s nano-ceramic coating extends lifespan to 2,800 hours, validated by SMIC. By 2024, costs dropped 40%, raising localization rates from 5% to 18%. Chiplet technology offers another path—Tongfu Microelectronics’ Hybrid Bonding cuts 7nm chip design costs from $30M to $18M at 98% yield, attracting 30% of HiSilicon orders.

Procurement tactics:

Start with non-core chambers: Pilot domestic rings in etcher secondary zones;

Co-development: Partner with suppliers like YMTC-SIASUN model;

Leverage Chiplet: Adopt JCET’s XDFOI™ for mid-range AI chips, cutting packaging costs by 40%.

Data Insight: Domestic rings cost $480 vs. Japan’s $800, reducing downtime by 30%.